In conventional ICs, all active circuitry rests on the silicon substrate, with additional layers of insulators and interconnects used only for wiring and mechanical strength. In contrast, Matrix’s unique 3-D architecture deposits multiple layers of active memory elements on a standard silicon substrate (or silicon surface) so that active circuitry is no longer confined to the silicon base, but extends vertically as well. This novel approach enables Matrix to build chips with a much smaller die area for a given density than existing technologies, optimizing use of expensive silicon real estate and dramatically increasing manufacturing yields. This fundamental innovation enables Matrix to introduce the lowest-cost-per-bit memory in the market.

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